Inventor
TSAI CHEN-WEN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “TSAI CHEN-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICON INTEGRATED SYS CORP
9 patentsUS6395996B1May 28, 2002
Multi-layered substrate with a built-in capacitor design
SILICON INTEGRATED SYS CORP104 citations97
US6653574B2Nov 25, 2003
Multi-layered substrate with a built-in capacitor design and a method of making the same
SILICON INTEGRATED SYS CORP17 citations92
US6524942B2Feb 25, 2003
Bond pad structure and its method of fabricating
SILICON INTEGRATED SYS CORP17 citations92
US6365970B1Apr 2, 2002
Bond pad structure and its method of fabricating
SILICON INTEGRATED SYS CORP21 citations92
US6116427ASep 12, 2000
Tray for ball grid array devices
SILICON INTEGRATED SYS CORP30 citations92
US6509646B1Jan 21, 2003
Apparatus for reducing an electrical noise inside a ball grid array package
SILICON INTEGRATED SYS CORP18 citations84
US6423577B1Jul 23, 2002
Method for reducing an electrical noise inside a ball grid array package
SILICON INTEGRATED SYS CORP10 citations65
US6498505B2Dec 24, 2002
Jigs for semiconductor components
SILICON INTEGRATED SYS CORP6 citations60
US6838756B2Jan 4, 2005
Chip-packaging substrate
SILICON INTEGRATED SYS CORP0 citations52