Inventor
MOTONARI MASAYUKI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “MOTONARI MASAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JSR CORP
12 patentsUS6579153B2Jun 17, 2003
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
JSR CORP101 citations97
US7183211B2Feb 27, 2007
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
JSR CORP29 citations92
US6832949B2Dec 21, 2004
Window member for chemical mechanical polishing and polishing pad
JSR CORP44 citations92
US6447695B1Sep 10, 2002
Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices
JSR CORP52 citations92
US6068769AMay 30, 2000
Aqueous dispersion slurry of inorganic particles and production methods thereof
JSR CORP20 citations92
US6565767B2May 20, 2003
Polymer particles and polishing material containing them
JSR CORP13 citations84
US8927201B2Jan 6, 2015
Multilayer resist process pattern-forming method and multilayer resist process inorganic film-forming composition
JSR CORP4 citations72
US7153369B2Dec 26, 2006
Method of chemical mechanical polishing
JSR CORP2 citations63
US9182671B2Nov 10, 2015
Method for forming pattern, and composition for forming resist underlayer film
JSR CORP1 citations51
US10090163B2Oct 2, 2018
Inorganic film-forming composition for multilayer resist processes, and pattern-forming method
JSR CORP1 citations50
US9091922B2Jul 28, 2015
Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming method
JSR CORP1 citations46
US9268229B2Feb 23, 2016
Composition for forming resist underlayer film, and pattern-forming method
JSR CORP0 citations42
TOSHIBA KK
4 patentsUS6454819B1Sep 24, 2002
Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
TOSHIBA KK108 citations98
US6375545B1Apr 23, 2002
Chemical mechanical method of polishing wafer surfaces
TOSHIBA KK131 citations98
US6653267B2Nov 25, 2003
Aqueous dispersion for chemical mechanical polishing used for polishing of copper
TOSHIBA KK13 citations84
US7087530B2Aug 8, 2006
Aqueous dispersion for chemical mechanical polishing
TOSHIBA KK5 citations63