Inventor
KAWAHASHI NOBUO
JP32 patents
⚠️ This page may combine multiple inventors who share the name “KAWAHASHI NOBUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JSR CORP
25 patentsUS6579153B2Jun 17, 2003
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
JSR CORP101 citations97
US6527818B2Mar 4, 2003
Aqueous dispersion for chemical mechanical polishing
JSR CORP77 citations97
US6582761B1Jun 24, 2003
Method of production of composited particle, composited particle produced by this method and aqueous dispersion for chemical mechanical polishing containing this composited particle, and method of production of aqueous dispersion for chemical mechanical polishing
JSR CORP64 citations96
US6924227B2Aug 2, 2005
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device
JSR CORP28 citations93
US7183211B2Feb 27, 2007
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
JSR CORP29 citations92
US7077879B2Jul 18, 2006
Composition for polishing pad and polishing pad using the same
JSR CORP28 citations92
US6832949B2Dec 21, 2004
Window member for chemical mechanical polishing and polishing pad
JSR CORP44 citations92
US6790883B2Sep 14, 2004
Composition for polishing pad and polishing pad using the same
JSR CORP36 citations92
US6447695B1Sep 10, 2002
Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices
JSR CORP52 citations92
US6383240B1May 7, 2002
Aqueous dispersion for chemical mechanical polishing
JSR CORP26 citations92
US6992123B2Jan 31, 2006
Polishing pad
JSR CORP28 citations91
US6786944B2Sep 7, 2004
Aqueous dispersion for chemical mechanical polishing
JSR CORP22 citations91
US7323415B2Jan 29, 2008
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
JSR CORP14 citations84
US7183213B2Feb 27, 2007
Chemical mechanical polishing pad and chemical mechanical polishing method
JSR CORP18 citations84
US7163448B2Jan 16, 2007
Chemical/mechanical polishing method for STI
JSR CORP10 citations84
US6559056B2May 6, 2003
Aqueous dispersion for chemical mechanical polishing
JSR CORP15 citations84
US7498294B2Mar 3, 2009
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device
JSR CORP15 citations83
US6740629B2May 25, 2004
Composition for washing a polishing pad and method for washing a polishing pad
JSR CORP17 citations82
US7252782B2Aug 7, 2007
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JSR CORP7 citations74
US7153369B2Dec 26, 2006
Method of chemical mechanical polishing
JSR CORP2 citations63
US7090786B2Aug 15, 2006
Aqueous dispersion for chemical/mechanical polishing
JSR CORP4 citations63
US6976910B2Dec 20, 2005
Polishing pad
JSR CORP5 citations63
US7378349B2May 27, 2008
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JSR CORP2 citations61
US7442116B2Oct 28, 2008
Chemical mechanical polishing pad
JSR CORP1 citations52
US7550020B2Jun 23, 2009
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JSR CORP0 citations42
TOSHIBA KK
4 patentsUS6935928B2Aug 30, 2005
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
TOSHIBA KK24 citations92
US7005382B2Feb 28, 2006
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
TOSHIBA KK30 citations91
US6653267B2Nov 25, 2003
Aqueous dispersion for chemical mechanical polishing used for polishing of copper
TOSHIBA KK13 citations84
US7087530B2Aug 8, 2006
Aqueous dispersion for chemical mechanical polishing
TOSHIBA KK5 citations63