Inventor
WANG CHUN MING
TW47 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHUN MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM MEMS TECHNOLOGIES INC
11 patentsUS7679812B2Mar 16, 2010
Support structure for MEMS device and methods therefor
QUALCOMM MEMS TECHNOLOGIES INC76 citations98
US7603001B2Oct 13, 2009
Method and apparatus for providing back-lighting in an interferometric modulator display device
QUALCOMM MEMS TECHNOLOGIES INC59 citations96
US7486867B2Feb 3, 2009
Methods for forming layers within a MEMS device using liftoff processes to achieve a tapered edge
QUALCOMM MEMS TECHNOLOGIES INC28 citations96
US7835093B2Nov 16, 2010
Methods for forming layers within a MEMS device using liftoff processes
QUALCOMM MEMS TECHNOLOGIES INC13 citations92
US7933475B2Apr 26, 2011
Method and apparatus for providing back-lighting in a display device
QUALCOMM MEMS TECHNOLOGIES INC25 citations91
US7704773B2Apr 27, 2010
MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same
QUALCOMM MEMS TECHNOLOGIES INC16 citations91
US7660058B2Feb 9, 2010
Methods for etching layers within a MEMS device to achieve a tapered edge
QUALCOMM MEMS TECHNOLOGIES INC22 citations91
US7969638B2Jun 28, 2011
Device having thin black mask and method of fabricating the same
QUALCOMM MEMS TECHNOLOGIES INC10 citations84
US7652814B2Jan 26, 2010
MEMS device with integrated optical element
QUALCOMM MEMS TECHNOLOGIES INC11 citations84
US7795061B2Sep 14, 2010
Method of creating MEMS device cavities by a non-etching process
QUALCOMM MEMS TECHNOLOGIES INC9 citations81
US7969641B2Jun 28, 2011
Device having power generating black mask and method of fabricating the same
QUALCOMM MEMS TECHNOLOGIES INC1 citations52
HITACHI GLOBAL STORAGE TECH
6 patentsUS7186348B2Mar 6, 2007
Method for fabricating a pole tip in a magnetic transducer
HITACHI GLOBAL STORAGE TECH36 citations92
US7211195B2May 1, 2007
Method for providing a liftoff process using a single layer resist and chemical mechanical polishing and sensor formed therewith
HITACHI GLOBAL STORAGE TECH10 citations84
US7506429B2Mar 24, 2009
Method of constructing a magnetic sensor
HITACHI GLOBAL STORAGE TECH5 citations63
US7472469B2Jan 6, 2009
Method for fabricating a magnetic head having a sensor stack and two lateral stack
HITACHI GLOBAL STORAGE TECH5 citations63
US7183224B2Feb 27, 2007
Liftoff process for thin photoresist
HITACHI GLOBAL STORAGE TECH2 citations63
US7742258B2Jun 22, 2010
Magnetic transducer with milling mask
HITACHI GLOBAL STORAGE TECH0 citations52
SANDISK 3D LLC
5 patentsUS7871909B1Jan 18, 2011
Methods of using single spacer to triple line/space frequency
SANDISK 3D LLC30 citations92
US7786015B2Aug 31, 2010
Method for fabricating self-aligned complementary pillar structures and wiring
SANDISK 3D LLC29 citations92
US7846756B2Dec 7, 2010
Nanoimprint enhanced resist spacer patterning method
SANDISK 3D LLC15 citations84
US7781269B2Aug 24, 2010
Triangle two dimensional complementary patterning of pillars
SANDISK 3D LLC9 citations84
US8026172B2Sep 27, 2011
Method of forming contact hole arrays using a hybrid spacer technique
SANDISK 3D LLC8 citations82
WANG CHUN-MING
4 patentsUS8076056B2Dec 13, 2011
Method of making sub-resolution pillar structures using undercutting technique
WANG CHUN-MING2 citations60
US8221943B2Jul 17, 2012
Photomask with assist features
WANG CHUN-MING0 citations49
US8394656B2Mar 12, 2013
Method of creating MEMS device cavities by a non-etching process
WANG CHUN-MING0 citations47
US8465906B2Jun 18, 2013
Method and mask for enhancing the resolution of patterning 2-row holes
WANG CHUN-MING0 citations38
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6261727B1Jul 17, 2001
DOF for both dense and isolated contact holes
TAIWAN SEMICONDUCTOR MFG43 citations92
US6586142B1Jul 1, 2003
Method to overcome image distortion of lines and contact holes in optical lithography
TAIWAN SEMICONDUCTOR MFG12 citations74
US6295123B1Sep 25, 2001
Multiple photon absorption for high resolution lithography
TAIWAN SEMICONDUCTOR MFG10 citations74
INNOCOM TECH SHENZHEN CO LTD
3 patentsSASAGAWA TERUO
2 patentsSANDISK TECHNOLOGIES INC
2 patentsSANDISK TECHNOLOGIES LLC
2 patentsUS9859363B2Jan 2, 2018
Self-aligned isolation dielectric structures for a three-dimensional memory device
SANDISK TECHNOLOGIES LLC15 citations82
US10553537B2Feb 4, 2020
Interconnects containing serpentine line structures for three-dimensional memory devices and methods of making the same
SANDISK TECHNOLOGIES LLC0 citations50