Inventor

SAKAI NORIO

JP103 patents

⚠️ This page may combine multiple inventors who share the name “SAKAI NORIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAKAI NORIO

MURATA MANUFACTURING CO

Method of producing ceramic multilayer substrate

Method of manufacturing a multilayer electronic component

Multilayer electronic component

Multilayer electronic component

Method of manufacturing a multilayer electronic component

Multilayer electronic component

Multilayer electronic component and method of manufacturing the same

Method of measuring characteristics of a multilayer electronic component

Method of manufacturing ceramic multilayer electronic component

Container with electromagnetic coupling module

Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same

Multilayer ceramic electronic component and manufacturing method thereof

Electronic component and method of producing the same

Mounting structure for an electronic component having an external terminal electrode

Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device

Method of manufacturing electronic component and measuring characteristics of same

Method of manufacturing ceramic laminate

Method of manufacturing ceramic laminate

Multilayer electronic component and structure for mounting multilayer electronic component

Ceramic multilayer substrate

Module with built-in component

Method of producing ceramic multilayer substrate

Circuit-forming charging powder and multilayer wiring board using the same

Method of handling electronic component chips

Method of manufacturing cavitied ceramic multilayer block

Method of handling electronic component chips

Method of fabricating ceramic laminated electronic component

Apparatus for forming electrode on electronic component

Retainer for chip-type electronic parts

Coil module

Method for manufacturing multilayer ceramic electronic device

Composite substrate and method for manufacturing composite substrate

Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component

Circuit module and circuit device including circuit module

Laminated electronic component and method for producing the same

Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device

Electrophotographic apparatus

Monolithic ceramic electronic component, method for manufacturing the same, and electronic device

Electronic component chip holder including two adhesive surfaces having different adhesiveness

Laminated ceramic electronic component having via-hole conductors with different sectional sizes

Method for making a mounting structure for an electronic component having an external terminal electrode

Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component

Multilayer integrated substrate and manufacturing method for multilayer ceramic element

Multilayered ceramic substrate and method of producing the same

Mounting arrangement for multilayer electronic part

Multilayer circuit board and method of producing the same

Module

Resin multilayer substrate

Monolithic ceramic substrate and method for making the same

MITSUBISHI HEAVY IND LTD

Compression membrane