Inventor

LE TAOJIN

CN2 patents

Patents

2 patents

US7361057B1Apr 22, 2008

Method and apparatus for soldering option of a highly integrated miniaturized form factor card

UTSTARCOM INC7 citations66

US7333339B2Feb 19, 2008

Heat dissipation system for a miniaturized form factor communications card

UTSTARCOM INC1 citations40