P

Inventor

MOK SEUNG-KON

KR15 patents
⚠️ This page may combine multiple inventors who share the name “MOK SEUNG-KON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

13 patents
US5677569AOct 14, 1997

Semiconductor multi-package stack

SAMSUNG ELECTRONICS CO LTD214 citations98
US5965947AOct 12, 1999

Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads

SAMSUNG ELECTRONICS CO LTD95 citations97
US7579583B2Aug 25, 2009

Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD16 citations83
US5621242AApr 15, 1997

Semiconductor package having support film formed on inner leads

SAMSUNG ELECTRONICS CO LTD14 citations73
US11626373B2Apr 11, 2023

Semiconductor packages including antenna pattern

SAMSUNG ELECTRONICS CO LTD2 citations72
US6638638B2Oct 28, 2003

Hollow solder structure having improved reliability and method of manufacturing same

SAMSUNG ELECTRONICS CO LTD11 citations72
US9793309B2Oct 17, 2017

Image sensor package

SAMSUNG ELECTRONICS CO LTD5 citations69
US9190401B2Nov 17, 2015

Stacked semiconductor packages

SAMSUNG ELECTRONICS CO LTD3 citations62
US12261135B2Mar 25, 2025

Semiconductor packages including antenna pattern

SAMSUNG ELECTRONICS CO LTD0 citations61
US7952199B2May 31, 2011

Circuit board including solder ball land having hole and semiconductor package having the circuit board

SAMSUNG ELECTRONICS CO LTD4 citations61
US6963033B2Nov 8, 2005

Ball grid array attaching means having improved reliability and method of manufacturing same

SAMSUNG ELECTRONICS CO LTD4 citations61
US10483150B2Nov 19, 2019

Apparatus for stacking semiconductor chips in a semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations50
US7667325B2Feb 23, 2010

Circuit board including solder ball land having hole and semiconductor package having the circuit board

SAMSUNG ELECTRONICS CO LTD1 citations50

YIM CHOONG-BIN

1 patent

CHO KYONG-SOON

1 patent