Inventor
TOKUTAKE YASUE
JP30 patents
⚠️ This page may combine multiple inventors who share the name “TOKUTAKE YASUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
18 patentsUS7659021B2Feb 9, 2010
Power generating apparatus using solid oxide fuel cell
SHINKO ELECTRIC IND CO33 citations92
US7656013B2Feb 2, 2010
Multilayer wiring substrate, method of manufacturing the same, and semiconductor device
SHINKO ELECTRIC IND CO8 citations82
US7655346B2Feb 2, 2010
Electrode material and fuel cell
SHINKO ELECTRIC IND CO3 citations63
US7786597B2Aug 31, 2010
Multilayer wiring board and semiconductor device
SHINKO ELECTRIC IND CO2 citations62
US7566513B2Jul 28, 2009
Solid electrolyte fuel cell with a multi-layer cathode formed of a solid electrolyte and electrode admixture
SHINKO ELECTRIC IND CO5 citations61
US7771886B2Aug 10, 2010
Fuel cell
SHINKO ELECTRIC IND CO1 citations51
US7445862B2Nov 4, 2008
Solid oxide fuel cell device
SHINKO ELECTRIC IND CO0 citations51
US8362369B2Jan 29, 2013
Wiring board
SHINKO ELECTRIC IND CO0 citations42
US9488677B2Nov 8, 2016
Probe card having a wiring substrate
SHINKO ELECTRIC IND CO0 citations41
US9476913B2Oct 25, 2016
Probe card
SHINKO ELECTRIC IND CO0 citations41
US9470718B2Oct 18, 2016
Probe card
SHINKO ELECTRIC IND CO0 citations41
US9459289B2Oct 4, 2016
Probe card and method for manufacturing probe card
SHINKO ELECTRIC IND CO0 citations41
US9373587B2Jun 21, 2016
Stacked electronic device
SHINKO ELECTRIC IND CO0 citations41
US9204544B2Dec 1, 2015
Wiring substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO0 citations41
US8053680B2Nov 8, 2011
Wiring board having efficiently arranged pads
SHINKO ELECTRIC IND CO0 citations41
US7803491B2Sep 28, 2010
Solid electrolyte fuel cell configuration
SHINKO ELECTRIC IND CO0 citations41
US7722980B2May 25, 2010
Solid oxide fuel cell directly utilizing flame
SHINKO ELECTRIC IND CO0 citations41
US9202781B2Dec 1, 2015
Wiring substrate, method for manufacturing wiring substrate, and semiconductor package
SHINKO ELECTRIC IND CO0 citations34
HORIUCHI MICHIO
9 patentsUS9460983B2Oct 4, 2016
Joining structure using thermal interface material
HORIUCHI MICHIO8 citations83
US8138609B2Mar 20, 2012
Semiconductor device and method of manufacturing semiconductor device
HORIUCHI MICHIO16 citations83
US9006586B2Apr 14, 2015
Wiring substrate, its manufacturing method, and semiconductor device
HORIUCHI MICHIO2 citations62
US8664764B2Mar 4, 2014
Semiconductor device including a core substrate and a semiconductor element
HORIUCHI MICHIO2 citations62
US8324513B2Dec 4, 2012
Wiring substrate and semiconductor apparatus including the wiring substrate
HORIUCHI MICHIO5 citations62
US8242612B2Aug 14, 2012
Wiring board having piercing linear conductors and semiconductor device using the same
HORIUCHI MICHIO3 citations61
US8057950B2Nov 15, 2011
Solid oxide fuel cell and method of manufacturing the same
HORIUCHI MICHIO0 citations51
US8638542B2Jan 28, 2014
Capacitor containing a large number of filamentous conductors and method of manufacturing the same
HORIUCHI MICHIO0 citations40
US9029041B2May 12, 2015
Solid oxide fuel cell
HORIUCHI MICHIO0 citations39