Inventor
ICHIKAWA KINYA
JP21 patents
⚠️ This page may combine multiple inventors who share the name “ICHIKAWA KINYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
17 patentsUS7345361B2Mar 18, 2008
Stackable integrated circuit packaging
INTEL CORP307 citations99
US9349703B2May 24, 2016
Method for making high density substrate interconnect using inkjet printing
INTEL CORP111 citations98
US6020561AFeb 1, 2000
Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof
INTEL CORP138 citations97
US9741664B2Aug 22, 2017
High density substrate interconnect formed through inkjet printing
INTEL CORP32 citations94
US6632704B2Oct 14, 2003
Molded flip chip package
INTEL CORP31 citations92
US5660321AAug 26, 1997
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
INTEL CORP31 citations91
US7132311B2Nov 7, 2006
Encapsulation of a stack of semiconductor dice
INTEL CORP41 citations90
US9502368B2Nov 22, 2016
Picture frame stiffeners for microelectronic packages
INTEL CORP5 citations84
US7495330B2Feb 24, 2009
Substrate connector for integrated circuit devices
INTEL CORP18 citations84
US7097462B2Aug 29, 2006
Patch substrate for external connection
INTEL CORP17 citations84
US6838313B2Jan 4, 2005
Molded flip chip package
INTEL CORP16 citations83
US7132739B2Nov 7, 2006
Encapsulated stack of dice and support therefor
INTEL CORP14 citations82
US6785148B1Aug 31, 2004
Easy mount socket
INTEL CORP8 citations74
US5811883ASep 22, 1998
Design for flip chip joint pad/LGA pad
INTEL CORP14 citations66
US7005729B2Feb 28, 2006
Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame
INTEL CORP4 citations62
US9685388B2Jun 20, 2017
Picture frame stiffeners for microelectronic packages
INTEL CORP1 citations52
US9263329B2Feb 16, 2016
Methods of connecting a first electronic package to a second electronic package
INTEL CORP0 citations52