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Inventor
YANG SHENG-SHU
TW
9 patents
⚠️ This page may combine multiple inventors who share the name “YANG SHENG-SHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN TFT LCD ASS
3 patents
US7576430B2
Aug 18, 2009
Bonding structure
TAIWAN TFT LCD ASS
10 citations
82
US7977788B2
Jul 12, 2011
Contact structure having a compliant bump and a testing area
TAIWAN TFT LCD ASS
8 citations
81
US7449716B2
Nov 11, 2008
Bond quality indication by bump structure on substrate
TAIWAN TFT LCD ASS
11 citations
81
IND TECH RES INST
2 patents
US6972490B2
Dec 6, 2005
Bonding structure with compliant bumps
IND TECH RES INST
65 citations
95
US10361235B2
Jul 23, 2019
Image sensor
IND TECH RES INST
5 citations
71
YANG SHENG-SHU
2 patents
US8736083B2
May 27, 2014
Bonding inspection structure
YANG SHENG-SHU
0 citations
38
US8215969B2
Jul 10, 2012
Contact structure and forming method thereof and connecting structure thereof
YANG SHENG-SHU
0 citations
35
CHANG SHYH-MING
1 patent
US8211788B2
Jul 3, 2012
Method of fabricating bonding structure
CHANG SHYH-MING
0 citations
44
CHEN WEN-CHIH
1 patent
US8164187B2
Apr 24, 2012
Flip chip device and manufacturing method thereof
CHEN WEN-CHIH
0 citations
38