Inventor
GUERIN LUC
CA20 patents
⚠️ This page may combine multiple inventors who share the name “GUERIN LUC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS6339534B1Jan 15, 2002
Compliant leads for area array surface mounted components
IBM29 citations92
US6302702B1Oct 16, 2001
Connecting devices and method for interconnecting circuit components
IBM30 citations90
US10784202B2Sep 22, 2020
High-density chip-to-chip interconnection with silicon bridge
IBM33 citations89
US9793232B1Oct 17, 2017
All intermetallic compound with stand off feature and method to make
IBM2 citations72
US7066740B2Jun 27, 2006
Area array package with low inductance connecting device
IBM7 citations69
US7868459B2Jan 11, 2011
Semiconductor package having non-aligned active vias
IBM2 citations63
US6652290B2Nov 25, 2003
Connecting devices and method for interconnecting circuit components
IBM2 citations60
US9269603B2Feb 23, 2016
Temporary liquid thermal interface material for surface tension adhesion and thermal control
IBM2 citations59
US7312523B2Dec 25, 2007
Enhanced via structure for organic module performance
IBM2 citations59
US7837419B2Nov 23, 2010
Methods involving marking molds
IBM1 citations50
US8383505B2Feb 26, 2013
Solder ball contact susceptible to lower stress
IBM0 citations48