Inventor
BUCHWALTER STEPHEN LESLIE
US22 patents
⚠️ This page may combine multiple inventors who share the name “BUCHWALTER STEPHEN LESLIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS6111323AAug 29, 2000
Reworkable thermoplastic encapsulant
IBM76 citations96
US5932682AAug 3, 1999
Cleavable diepoxide for removable epoxy compositions
IBM55 citations94
US5659203AAug 19, 1997
Reworkable polymer chip encapsulant
IBM71 citations94
US7786001B2Aug 31, 2010
Electrical interconnect structure and method
IBM16 citations93
US6919420B2Jul 19, 2005
Acid-cleavable acetal and ketal based epoxy oligomers
IBM21 citations91
US5786986AJul 28, 1998
Multi-level circuit card structure
IBM61 citations91
US5930597AJul 27, 1999
Reworkable polymer chip encapsulant
IBM38 citations90
US5879859AMar 9, 1999
Strippable photoimageable compositions
IBM23 citations89
US7776993B2Aug 17, 2010
Underfilling with acid-cleavable acetal and ketal epoxy oligomers
IBM8 citations82
US6531343B1Mar 11, 2003
Method of encapsulating a circuit assembly
IBM5 citations74
US6326237B1Dec 4, 2001
Reworkable thermoplastic hyper-branched encapsulant
IBM6 citations74
US5998876ADec 7, 1999
Reworkable thermoplastic hyper-branched encapsulant
IBM13 citations74
US5891526AApr 6, 1999
Apparatus for mixing a multi-component encapsulant and injecting it through a heated nozzle onto a part to be encapsulated
IBM7 citations74
US5776370AJul 7, 1998
Charge transfer complexes between polyaniline and organic electron acceptors and method of fabrication
IBM11 citations74
US5858943AJan 12, 1999
Gel for localized removal of reworkable encapsulant
IBM6 citations73
US6369452B1Apr 9, 2002
Cap attach surface modification for improved adhesion
IBM6 citations72
US6258899B1Jul 10, 2001
Cleavable acetal-containing diepoxide and anhydride curing agent for removable epoxy compositions
IBM6 citations71
US6803256B2Oct 12, 2004
Cap attach surface modification for improved adhesion
IBM2 citations61
US7064013B2Jun 20, 2006
Cap attach surface modification for improved adhesion
IBM0 citations50