Inventor

COBBLEY CHAD A

US111 patents

⚠️ This page may combine multiple inventors who share the name “COBBLEY CHAD A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COBBLEY CHAD A

MICRON TECHNOLOGY INC

Stacked die module and techniques for forming a stacked die module

Image sensor packages

Semiconductor component having stacked, encapsulated dice

Apparatus and method of stacking die on a substrate

Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities

Packages for semiconductor die

Semiconductor die back side surface and method of fabrication

Semiconductor dice packages employing at least one redistribution layer

Stackable ball grid array

Adhesive composition for use in packaging applications

Method for packaging microelectronic substrates

Semiconductor component having encapsulated die stack

Method of encapsulating interconnecting units in packaged microelectronic devices

Method for fabricating semiconductor component having stacked, encapsulated dice

Method of packaging semiconductor dice employing at least one redistribution layer

Method of disposing conductive bumps onto a semiconductor device

Techniques for packaging multiple device components

Apparatus and methods of automated wafer-grinding using grinding surface position monitoring

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

Method for in-line testing of flip-chip semiconductor assemblies

Method of locating conductive spheres utilizing screen and hopper of solder balls

Thin stacked ball-grid array package

Semiconductor component having stacked, encapsulated dice and method of fabrication

Techniques for packaging multiple device components

Methods of fabrication of package assemblies for optically interactive electronic devices

Techniques for packaging a multiple device component

Method of manufacturing a stackable ball grid array

Sealed electronic device packages with transparent coverings

Packaged microelectronic devices with interconnecting units

Stacked die module and techniques for forming a stacked die module

Semiconductor package with molded flash

Ball grid array packages with thermally conductive containers

Automated method of attaching flip chip devices to a substrate

Packages for semiconductor die

Method of depositing a thermoplastic polymer in semiconductor fabrication

Method of depositing a thermoplastic polymer in semiconductor fabrication

Semiconductor device structures and electronic devices including same hybrid conductive vias

Moisture-resistant electronic device package and methods of assembly

Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices

Moisture-resistant electronic device package and methods of assembly

Electrical interconnect using locally conductive adhesive

Adhesive composition and methods for use in packaging applications

Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement

Method of locating conductive spheres utilizing screen and hopper of solder balls

Semiconductor die attachment method and apparatus

Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

Techniques for packaging a multiple device component

Ball grid array packages with thermally conductive containers

ROUND ROCK RES LLC

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor