Inventor

JU JONG WOOK

KR18 patents

⚠️ This page may combine multiple inventors who share the name “JU JONG WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JU JONG WOOK

STATS CHIPPAC LTD

Integrated circuit package system including honeycomb molding

Stacked integrated circuit package system with connection protection

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Hybrid stacking package system

LEE SANG HO

Adhesive/spacer island structure for multiple die package

Adhesive/spacer island structure for stacking over wire bonded die

KO WONJUN

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

Integrated circuit package system with package integration

KWON HYEOG CHAN

Integrated circuit package system with planar interconnects

Integrated circuit package system including honeycomb molding

JU JONG WOOK

Integrated circuit package system with offset stack

KIM HYUNJOO

Workpiece displacement system

KIM OHSUG

Stacked integrated circuit package-in-package system and method of manufacture thereof

YUN JA EUN

Integrated circuit package system with overhang die

DO BYUNG TAI

Integrated circuit package system including die having relieved active region

CHIPPAC INC

Semiconductor chip packaging method with individually placed film adhesive pieces

YUN JAEUN

Integrated circuit packaging system with heat spreader and method of manufacture thereof