Inventor

JACKSON TIMOTHY L

US24 patents

⚠️ This page may combine multiple inventors who share the name “JACKSON TIMOTHY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JACKSON TIMOTHY L

MICRON TECHNOLOGY INC

Stacked die module and techniques for forming a stacked die module

Thin flip—chip method

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies

Method of making ball grid array package with deflectable interconnect

Deflectable interconnect

Thin flip-chip method

Thin flip-chip method

Thin flip-chip method

Stacked die module and techniques for forming a stacked die module

Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip

Deflectable interconnect

Deflectable interconnect

Stacked die module and techniques for forming a stacked die module

Stacked die module and techniques for forming a stacked die module

Reciprocating staging fixture

Stacked die module including multiple adhesives that cure at different temperatures

Deflectable interconnect

ADVANCED MICRO DEVICES INC

Method and apparatus for fault detection using multiple tool error signals

Process control based on an estimated process result

Verifying a fault detection result based on a process control state

Method and apparatus for adaptive sampling based on process covariance

MICRONTECHNOLOGY INC

Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof

(unassigned)

Combination toolbox-cooler device