P

Inventor

KONDOU RYUICHI

JP7 patents
⚠️ This page may combine multiple inventors who share the name “KONDOU RYUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIYO YUDEN KK

4 patents
US9892843B2Feb 13, 2018

Laminated inductor

TAIYO YUDEN KK4 citations71
US7847469B2Dec 7, 2010

Micro-cantilever

TAIYO YUDEN KK4 citations61
US10217557B2Feb 26, 2019

Laminated inductor

TAIYO YUDEN KK0 citations51
US10096418B2Oct 9, 2018

Laminated inductor

TAIYO YUDEN KK1 citations51

SUGA TADATOMO

2 patents
US10166749B2Jan 1, 2019

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

SUGA TADATOMO2 citations71
US9601350B2Mar 21, 2017

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

SUGA TADATOMO6 citations71

KONDOU RYUICHI

1 patent
US8853544B2Oct 7, 2014

Method of transferring thin film components and circuit board having the same

KONDOU RYUICHI1 citations43