Inventor

MURUGAN RAJEN MANICON

US43 patents

⚠️ This page may combine multiple inventors who share the name “MURUGAN RAJEN MANICON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURUGAN RAJEN MANICON

TEXAS INSTRUMENTS INC

Packaged semiconductor device

Package substrate having integrated passive device(s) between leads

Microelectronic device package including antenna and semiconductor device

Antenna-on-package including multiple types of antenna

Plated metal layer in power packages

Electronic device multilevel package substrate for improved electromigration preformance

Multilayer package substrate with stress buffer

Hall-effect sensor package with added current path

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Microelectronic device package including antenna and semiconductor device

Plated metal layer in power packages

Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same

Integrated circuit package for isolation dies

Microelectronic device package including antenna horn and semiconductor device

Antenna-on-package including multiple types of antenna

High-frequency ceramic packages with modified castellation and metal layer architectures

Ceramic semiconductor package seal rings

Package substrate having integrated passive device(s) between leads

Ceramic semiconductor package seal rings

Multilayer package substrate with stress buffer

Electronic device multilevel package substrate for improved electromigration performance

Integrated system-in-package with radiation shielding

Packaged semiconductor device

Hall-effect sensor package with added current path

Integrated system-in-package with radiation shielding

Passives to facilitate mold compound flow

High current packages with reduced solder layer count

High current packages with reduced solder layer count

Semiconductor device with multiple dies

Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate

Semiconductor device with a power converter module connected to connection assembly

Integrated magnetic assembly

Antenna in package having antenna on package substrate

Semiconductor package with shunt and patterned metal trace

Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Packaged electronic device and multilevel lead frame coupler

Electronic device with patch antenna in packaging substrate

System, electronic device and package with vertical to horizontal substrate integrated waveguide transition and horizontal grounded coplanar waveguide transition

TASC LTD

High definition electrical impedance tomography

TEXAS INSTR INCORPORATED

Substrate-integrated waveguide

WEXLER ALVIN

High definition impedance imaging