Inventor
OZAWA ISAO
JP40 patents
⚠️ This page may combine multiple inventors who share the name “OZAWA ISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
16 patentsUSD778851SFeb 14, 2017
Substrate for an electronic circuit
TOSHIBA KK32 citations98
USD673921SJan 8, 2013
Portion of a substrate for an electronic circuit
TOSHIBA KK75 citations98
USD673922SJan 8, 2013
Portion of a substrate for an electronic circuit
TOSHIBA KK77 citations95
USD730304SMay 26, 2015
Substrate for an electronic circuit
TOSHIBA KK32 citations94
USD778852SFeb 14, 2017
Substrate for an electronic circuit
TOSHIBA KK20 citations93
USD778850SFeb 14, 2017
Substrate for an electronic circuit
TOSHIBA KK18 citations93
USD764424SAug 23, 2016
Substrate for an electronic circuit
TOSHIBA KK20 citations93
US7339257B2Mar 4, 2008
Semiconductor device in which semiconductor chip is mounted on lead frame
TOSHIBA KK35 citations89
US6995320B2Feb 7, 2006
Wiring board and a packaging assembly using the same
TOSHIBA KK11 citations81
US6791193B2Sep 14, 2004
Chip mounting substrate, first level assembly, and second level assembly
TOSHIBA KK8 citations74
US9275947B2Mar 1, 2016
Semiconductor device and semiconductor package having a plurality of differential signal balls
TOSHIBA KK6 citations72
US9704593B2Jul 11, 2017
Data storage device including nonvolatile memory in which on/off state of power source voltage is controlled
TOSHIBA KK2 citations71
US7919837B2Apr 5, 2011
Semiconductor device with sealed semiconductor chip
TOSHIBA KK2 citations63
USD473198SApr 15, 2003
Semiconductor device
TOSHIBA KK5 citations61
US7495329B2Feb 24, 2009
Semiconductor memory card
TOSHIBA KK2 citations53
US9543271B2Jan 10, 2017
Semiconductor device having a sealing layer covering a semiconductor memory unit and a memory controller
TOSHIBA KK0 citations52
TOSHIBA MEMORY CORP
8 patentsUS10297571B2May 21, 2019
Semiconductor package
TOSHIBA MEMORY CORP5 citations73
US10090235B2Oct 2, 2018
Semiconductor device and semiconductor package
TOSHIBA MEMORY CORP2 citations72
US9911502B2Mar 6, 2018
Data storage device with nonvolatile memory
TOSHIBA MEMORY CORP2 citations71
US10872844B2Dec 22, 2020
Semiconductor device with sealed semiconductor chip
TOSHIBA MEMORY CORP0 citations52
US10366942B2Jul 30, 2019
Semiconductor device with sealed semiconductor chip
TOSHIBA MEMORY CORP0 citations52
US10566274B2Feb 18, 2020
Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals
TOSHIBA MEMORY CORP0 citations51
US10409338B2Sep 10, 2019
Semiconductor device package having an oscillator and an apparatus having the same
TOSHIBA MEMORY CORP0 citations49
US10204661B2Feb 12, 2019
Semiconductor device
TOSHIBA MEMORY CORP0 citations42
OZAWA ISAO
4 patentsUS8131912B2Mar 6, 2012
Memory system
OZAWA ISAO21 citations92
US4310682AJan 12, 1982
Halo-salicylanilide
OZAWA ISAO16 citations69
US8970019B2Mar 3, 2015
Semiconductor device with sealed semiconductor chip
OZAWA ISAO1 citations62
US9087831B2Jul 21, 2015
Semiconductor module including first and second wiring portions separated from each other
OZAWA ISAO0 citations41
TOYODA GOSEI KK
4 patentsUS4583723AApr 22, 1986
Elastically damping device for suspension of engine
TOYODA GOSEI KK52 citations92
US4360549ANov 23, 1982
Molding
TOYODA GOSEI KK41 citations92
US4635910AJan 13, 1987
Fluid-filled damper device
TOYODA GOSEI KK31 citations91
US4492366AJan 8, 1985
Elastically damping device for the suspension of an engine
TOYODA GOSEI KK19 citations69