Inventor
MATSUOKA TATSURU
JP21 patents
⚠️ This page may combine multiple inventors who share the name “MATSUOKA TATSURU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
12 patentsUS10770287B2Sep 8, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP6 citations84
US11817314B2Nov 14, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11164741B2Nov 2, 2021
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11515143B2Nov 29, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and method of processing substrate
KOKUSAI ELECTRIC CORP2 citations72
US12288684B2Apr 29, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12009201B2Jun 11, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11967499B2Apr 23, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11664217B2May 30, 2023
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11094532B2Aug 17, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11056337B2Jul 6, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US10804100B2Oct 13, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US10790136B2Sep 29, 2020
Method of manufacturing semiconductor device, substrate processing system and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations51
HITACHI INT ELECTRIC INC
8 patentsUS9583338B2Feb 28, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC5 citations73
US10626502B2Apr 21, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations62
US10755921B2Aug 25, 2020
Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
HITACHI INT ELECTRIC INC0 citations52
US9741555B2Aug 22, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations52
US10096463B2Oct 9, 2018
Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording medium
HITACHI INT ELECTRIC INC1 citations50
US10910214B2Feb 2, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations47
US10074535B2Sep 11, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations41
US9934962B2Apr 3, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations41