Inventor
MA ZHAOHUI
SG21 patents
⚠️ This page may combine multiple inventors who share the name “MA ZHAOHUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
17 patentsUS9865578B2Jan 9, 2018
Methods of manufacturing multi-die semiconductor device packages and related assemblies
MICRON TECHNOLOGY INC4 citations84
US9589933B2Mar 7, 2017
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies
MICRON TECHNOLOGY INC6 citations84
US9349670B2May 24, 2016
Semiconductor die assemblies with heat sink and associated systems and methods
MICRON TECHNOLOGY INC11 citations83
US10103134B2Oct 16, 2018
Methods of manufacturing multi-die semiconductor device packages and related assemblies
MICRON TECHNOLOGY INC2 citations73
US9786612B2Oct 10, 2017
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies
MICRON TECHNOLOGY INC3 citations73
US10923448B2Feb 16, 2021
Bond pad with micro-protrusions for direct metallic bonding
MICRON TECHNOLOGY INC2 citations72
US10153178B2Dec 11, 2018
Semiconductor die assemblies with heat sink and associated systems and methods
MICRON TECHNOLOGY INC2 citations72
US9716019B2Jul 25, 2017
Semiconductor die assemblies with heat sink and associated systems and methods
MICRON TECHNOLOGY INC2 citations72
US10312226B2Jun 4, 2019
Semiconductor devices comprising protected side surfaces and related methods
MICRON TECHNOLOGY INC2 citations70
US9786643B2Oct 10, 2017
Semiconductor devices comprising protected side surfaces and related methods
MICRON TECHNOLOGY INC3 citations70
US12087719B2Sep 10, 2024
Bond pad with micro-protrusions for direct metallic bonding
MICRON TECHNOLOGY INC0 citations62
US11705425B2Jul 18, 2023
Thermocompression bond tips and related apparatus and methods
MICRON TECHNOLOGY INC0 citations62
US11024595B2Jun 1, 2021
Thermocompression bond tips and related apparatus and methods
MICRON TECHNOLOGY INC0 citations62
US11670612B2Jun 6, 2023
Method for solder bridging elimination for bulk solder C2S interconnects
MICRON TECHNOLOGY INC1 citations61
US10636678B2Apr 28, 2020
Semiconductor die assemblies with heat sink and associated systems and methods
MICRON TECHNOLOGY INC0 citations51
US9337064B2May 10, 2016
Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systems
MICRON TECHNOLOGY INC0 citations51
US10734370B2Aug 4, 2020
Methods of making semiconductor devices
MICRON TECHNOLOGY INC0 citations49