Inventor
DEMAREST JAMES J
US38 patents
⚠️ This page may combine multiple inventors who share the name “DEMAREST JAMES J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
34 patentsUS9666528B1May 30, 2017
BEOL vertical fuse formed over air gap
IBM430 citations99
US7122898B1Oct 17, 2006
Electrical programmable metal resistor
IBM15 citations93
US9449871B1Sep 20, 2016
Hybrid airgap structure with oxide liner
IBM21 citations92
US7402532B2Jul 22, 2008
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
IBM28 citations92
US7102232B2Sep 5, 2006
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
IBM19 citations92
US10043746B1Aug 7, 2018
Fabrication of vertical fuses from vertical fins
IBM11 citations84
US9985097B2May 29, 2018
Integrated capacitors with nanosheet transistors
IBM7 citations84
US9780027B2Oct 3, 2017
Hybrid airgap structure with oxide liner
IBM13 citations84
US9978678B1May 22, 2018
Vertically integrated nanosheet fuse
IBM5 citations83
US10319677B2Jun 11, 2019
Fabrication of vertical fuses from vertical fins
IBM2 citations73
US10170548B2Jan 1, 2019
Integrated capacitors with nanosheet transistors
IBM3 citations73
US9953915B2Apr 24, 2018
Electrically conductive interconnect including via having increased contact surface area
IBM3 citations73
US9793213B2Oct 17, 2017
Ion flow barrier structure for interconnect metallization
IBM2 citations73
US9553044B2Jan 24, 2017
Electrically conductive interconnect including via having increased contact surface area
IBM2 citations73
US9057670B2Jun 16, 2015
Transmission electron microscope sample fabrication
IBM5 citations73
US10475878B2Nov 12, 2019
BEOL capacitor through airgap metallization
IBM3 citations72
US7820559B2Oct 26, 2010
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer
IBM4 citations72
US7287325B2Oct 30, 2007
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing
IBM3 citations63
US11113533B2Sep 7, 2021
Smart display apparatus and control system
IBM0 citations61
US10528817B2Jan 7, 2020
Smart display apparatus and control system
IBM1 citations61
US10043748B1Aug 7, 2018
Vertically integrated nanosheet fuse
IBM1 citations61
US9184042B1Nov 10, 2015
Wafer backside particle mitigation
IBM2 citations61
US10546813B2Jan 28, 2020
BEOL vertical fuse formed over air gap
IBM0 citations52
US10453793B2Oct 22, 2019
BEOL vertical fuse formed over air gap
IBM0 citations52
US10083908B2Sep 25, 2018
BEOL vertical fuse formed over air gap
IBM0 citations52
US9997454B2Jun 12, 2018
BEOL vertical fuse formed over air gap
IBM0 citations52
US9966305B2May 8, 2018
Ion flow barrier structure for interconnect metallization
IBM0 citations52
US7651892B2Jan 26, 2010
Electrical programmable metal resistor
IBM0 citations52
US10566414B2Feb 18, 2020
BEOL capacitor through airgap metallization
IBM0 citations51
US10319676B2Jun 11, 2019
Vertically integrated nanosheet fuse
IBM0 citations51
US9318347B2Apr 19, 2016
Wafer backside particle mitigation
IBM0 citations51
US7835564B2Nov 16, 2010
Non-destructive, below-surface defect rendering using image intensity analysis
IBM2 citations49
US7473636B2Jan 6, 2009
Method to improve time dependent dielectric breakdown
IBM0 citations42
US9331073B2May 3, 2016
Epitaxially grown quantum well finFETs for enhanced pFET performance
IBM0 citations40