Inventor

KOTAKE TOMOHIKO

JP33 patents

⚠️ This page may combine multiple inventors who share the name “KOTAKE TOMOHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOTAKE TOMOHIKO

HITACHI CHEMICAL CO LTD

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

Aerogel

Sol composition, aerogel composite, support member provided with aerogel composite, and heat insulator

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

Aerogel composite powder

Sol composition

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Production method for aerogel laminate, and aerogel laminate roll

Barrier material formation composition, barrier material, production method for barrier material, product, and production method for product

Aerogel laminated composite and thermal insulation material

Coating solution, method for producing coating film, and coating film

Treatment agent for treating fibers, fibers and production method therefor, and fiber sheet and production method therefor

Coating solution, method for producing coating film, and coating film

Aerogel and method for producing same

Aerogel

Aerogel

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

Aerogel laminate and thermal insulation material

Production method for aerogel laminate, and aerogel laminate roll

Coating liquid, production method for coating film, and coating film

Treatment agent for treating particles, water- repellent particles and production method therefor, water-repellent layer, and penetration preventing structure

Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

Thermosetting resin composition and prepreg and laminate both made with the same

SHOWA DENKO MATERIALS CO LTD

Composite material, sheet, and heat insulator

Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package

Coating liquid, composite material, and coating film

KOTAKE TOMOHIKO

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

Prepreg, laminate obtained with the same and printed-wiring board

TSUCHIKAWA SHINJI

Thermosetting resin composition and prepreg and laminate obtained with the same

RESONAC CORP

Method for suppressing corrosion under heat-insulating material, and paste for suppressing corrosion under heat-insulating material

NAGAI SHUNSUKE

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

MIYATAKE MASATO

Resin composition, prepreg laminate obtained with the same and printed-wiring board