Inventor

WONG CHING-PING

US60 patents

⚠️ This page may combine multiple inventors who share the name “WONG CHING-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WONG CHING-PING

GEORGIA TECH RES INST

No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant

Process and material for low-cost flip-chip solder interconnect structures

High dielectric constant nano-structure polymer-ceramic composite

Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane

High dielectric polymer composites and methods of preparation thereof

No-flow reworkable epoxy underfills for flip-chip applications

Reworkable high temperature adhesives

Reworkable epoxy underfill encapsulants

Insulator coating and method for forming same

Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulation

Thermally degradable epoxy underfills for flip-chip applications

Metal-assisted chemical etching of a semiconductive substrate with high aspect ratio, high geometic uniformity, and controlled 3D profiles

Electrically conductive adhesives and methods of making

AT & T BELL LAB

Devices featuring silicone elastomers

Silicone resin electronic device encapsulant

Silicone encapsulant

Methods for encapsulating electronic devices

Method for encapsulating integrated circuit

Devices featuring silicone elastomers

Method of encapsulating an electronic device with a silicone encapsulant

Encapsulant method and apparatus

Silicone material

WESTERN ELECTRIC CO

Method of removing a cured epoxy from a metal surface

Stabilized catalyzed organopolysiloxanes

Encapsulated electronic devices and encapsulating compositions

Encapsulated electronic devices and encapsulating compositions having crown ethers

Method of repairing a defective photomask

Encapsulated electronic devices and encapsulating compositions

Encapsulated electronic devices and encapsulating compositions

Mask for selectively transmitting therethrough a desired light radiant energy

Mask for selectively transmitting therethrough a desired light radiant energy

AT & T TECHNOLOGIES INC

Silicone encapsulated devices

Encapsulated electronic circuit

Stabilized silicone gels

Process for cleaning a circuit board

Silicone encapsulated devices

Silicone encapsulant containing porphyrin

AT & T CORP

Encapsulation techniques which include forming a thin glass layer onto a polymer layer

Method for curing silicone resins

Method for encapsulating electronic conductors

Terpene-based method for removing flux residues from electronic devices

LUCENT TECHNOLOGIES INC

Method of encapsulating an electronic device

Method for cleaning an object soldered with a lead-containing solder

Cleaning with limonene, BHT, and acetylacetonate

HILDRETH OWEN

Methods and systems for metal-assisted chemical etching of substrates

LIN WEI

Structures including carbon nanotubes, methods of making structures, and methods of using structures

WATKINS JR KENNETH S

Electrical condition monitoring method for polymers

POLYMER AGING CONCEPTS INC

Electrical condition monitoring method for polymers

AMERICAN TELEPHONE & TELEGRAPH

Silicone encapsulated devices

BURGOYNE JR WILLIAM FRANKLIN

Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives