P

Inventor

XU JIANWEN

US22 patents
⚠️ This page may combine multiple inventors who share the name “XU JIANWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

5 patents
US10141202B2Nov 27, 2018

Semiconductor device comprising mold for top side and sidewall protection

QUALCOMM INC2 citations71
US12218041B2Feb 4, 2025

Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods

QUALCOMM INC1 citations63
US8841168B2Sep 23, 2014

Soldering relief method and semiconductor device employing same

QUALCOMM INC2 citations56
US11784157B2Oct 10, 2023

Package comprising integrated devices coupled through a metallization layer

QUALCOMM INC0 citations50
US9318405B2Apr 19, 2016

Wafer level package without sidewall cracking

QUALCOMM INC1 citations47

XU JIANWEN

4 patents
US8609471B2Dec 17, 2013

Packaging an integrated circuit die using compression molding

XU JIANWEN21 citations91
US8617935B2Dec 31, 2013

Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages

XU JIANWEN14 citations83
US8327532B2Dec 11, 2012

Method for releasing a microelectronic assembly from a carrier substrate

XU JIANWEN8 citations83
US9054111B2Jun 9, 2015

Electronic device and method of packaging an electronic device

XU JIANWEN0 citations41

SONG JIE

3 patents
US8597630B2Dec 3, 2013

Thermal-responsive polymer networks, compositions, and methods and applications related thereto

SONG JIE6 citations83
US9388276B2Jul 12, 2016

Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogels

SONG JIE3 citations72
US8765112B2Jul 1, 2014

Thermal responsive polymer siloxanes, compositions, and method and applications related thereto

SONG JIE2 citations62

GONG ZHIWEI

2 patents
US8216918B2Jul 10, 2012

Method of forming a packaged semiconductor device

GONG ZHIWEI22 citations92
US9034697B2May 19, 2015

Apparatus and methods for quad flat no lead packaging

GONG ZHIWEI0 citations52

UNIV MASSACHUSETTS MEDICAL SCHOOL

2 patents
US10752614B2Aug 25, 2020

Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and peg-co-polycarbonate hydrogels

UNIV MASSACHUSETTS MEDICAL SCHOOL0 citations51
US9908871B2Mar 6, 2018

Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogels

UNIV MASSACHUSETTS MEDICAL SCHOOL0 citations51

FREESCALE SEMICONDUCTOR INC

1 patent
US7595226B2Sep 29, 2009

Method of packaging an integrated circuit die

FREESCALE SEMICONDUCTOR INC65 citations98

GEORGIA TECH RES INST

1 patent
US6864306B2Mar 8, 2005

High dielectric polymer composites and methods of preparation thereof

GEORGIA TECH RES INST27 citations92

UNIV MASSACHUSETTS MEDICAL

1 patent
US9259509B2Feb 16, 2016

Thermal responsive polymer siloxanes, compositions, and method and applications related thereto

UNIV MASSACHUSETTS MEDICAL5 citations84

RAMANATHAN LAKSHMI N

1 patent
US8236609B2Aug 7, 2012

Packaging an integrated circuit die with backside metallization

RAMANATHAN LAKSHMI N3 citations57

KINIKSA PHARMACEUTICALS GMBH

1 patent
US12502352B1Dec 23, 2025

Formulations of anti-interleukin 1 receptor 1 antibodies

KINIKSA PHARMACEUTICALS GMBH0 citations56

SCHWARZ MARK WENDELL

1 patent
US8461676B2Jun 11, 2013

Soldering relief method and semiconductor device employing same

SCHWARZ MARK WENDELL0 citations39