Inventor

MATSUURA MASAMITSU

JP19 patents

⚠️ This page may combine multiple inventors who share the name “MATSUURA MASAMITSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUURA MASAMITSU

TEXAS INSTRUMENTS INC

Metal ribs in electromechanical devices

Semiconductor package with multilayer mold

Conductive members atop semiconductor packages

Hall sensor using face down structure with through substrate vias

Metal ribs in electromechanical devices

Wafer chip scale package

Semiconductor package having an interdigitated mold arrangement

Leaded wafer chip scale packages

Wire bonded semiconductor device package

Leaded semiconductor device package having leads with different widths

Stress buffer layer in embedded package

Embedded die package multichip module

Stress buffer layer in embedded package

Fan-out electronic device

Dual down-set conductive terminals for externally mounted passive components

Semiconductor device having tapered metal coated sidewalls

Package for stress sensitive component and semiconductor device

High reliability sensor

SUZUKI MOTOR CO

Vehicular vibration isolating apparatus