Inventor
SUNG KAO-MEI
TW2 patents
Patents
2 patentsUS12295185B2May 6, 2025
Epitaxial substrate having a 2D material interposer, method for manufacturing the epitaxial substrate, and device prepared from the epitaxial substrate
WANG HSIAO LEI0 citations40
US10297446B2May 21, 2019
Encapsulated substrate, manufacturing method, high band-gap device having encapsulated substrate
WANG HSIAO LEI0 citations29