Inventor
LIS ADRIAN
DE8 patents
Patents
8 patentsUS12224222B2Feb 11, 2025
Semiconductor package having a thermally and electrically conductive spacer
INFINEON TECHNOLOGIES AG0 citations60
US12300643B2May 13, 2025
Solder stop feature for electronic devices
INFINEON TECHNOLOGIES AG0 citations58
US12062589B2Aug 13, 2024
Semiconductor packages including recesses to contain solder
INFINEON TECHNOLOGIES AG0 citations58
US12334458B2Jun 17, 2025
Package with pad having open notch
INFINEON TECHNOLOGIES AG0 citations57
US12374661B2Jul 29, 2025
Power module having vertically aligned first and second substrates
INFINEON TECHNOLOGIES AG0 citations50
US12113000B2Oct 8, 2024
Lead adapters for semiconductor package
INFINEON TECHNOLOGIES AG0 citations50
US12183667B2Dec 31, 2024
Semiconductor package with power electronics carrier having trench spacing adapted for delamination
INFINEON TECHNOLOGIES AG0 citations48
US12469770B2Nov 11, 2025
Power semiconductor module with rivet or press fit pin and method for fabricating the same
INFINEON TECHNOLOGIES AG0 citations45