Inventor
Fu yi-min
TW12 patents
Patents
12 patentsUS12593698B2Mar 31, 2026
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12525505B2Jan 13, 2026
Electronic package of two vertically stacked chips with chip-to-chip bump connections and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12438094B2Oct 7, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12412819B2Sep 9, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12412820B2Sep 9, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12334452B2Jun 17, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12051641B2Jul 30, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12199047B2Jan 14, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US12176291B2Dec 24, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56
US10396021B2Aug 27, 2019
Fabrication method of layer structure for mounting semiconductor device
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9972564B2May 15, 2018
Layer structure for mounting semiconductor device and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US12575420B2Mar 10, 2026
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46