Inventor

TAKEMURA KATSUYA

JP82 patents

⚠️ This page may combine multiple inventors who share the name “TAKEMURA KATSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKEMURA KATSUYA

SHINETSU CHEMICAL CO

Photoacid generators, chemically amplified resist compositions, and patterning process

Chemically amplified positive resist composition

Polysiloxane compounds and positive resist compositions

Positive resist composition

Sulfonium salts and chemically amplified positive resist compositions

Chemically amplified positive resist compositions

Chemically amplified positive resist composition and patterning method

Chemically amplified positive resist composition and patterning method

Resist compositions and patterning process

High molecular weight silicone compounds, chemically amplified positive resist compositions, and patterning method

Sulfonium salts and chemically amplified positive resist compositions

Resist composition with polymeric dissolution inhibitor and alkali soluble resin

Chemically amplified positive resist compositions

Sulfonium salt and resist composition

Silicone structure-bearing polymer, resin composition, and photo-curable dry film

Patterning process and resist composition

Positive resist material and pattern formation method using the same

Fine contact hole forming method employing thermal flow process

Resist composition and patterning process

Method of forming resist pattern utilizing fluorinated resin antireflective film layer

Nitrogen-containing organic compound, resist composition and patterning process

Nitrogen-containing organic compound, chemically amplified resist composition and patterning process

Nitrogen-containing organic compound, resist composition and patterning process

Sulfonium salt and chemically amplified positive resist composition

Tristertbutoxyphenyl sulfonium tosylate compound

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film

Chemically amplified positive resist composition and patterning process

Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film

Chemical amplification resist compositions

Bisphenol carboxylic acid tertiary ester derivatives and chemically amplified positive resist compositions

Naphthalene derivative, resist bottom layer material, and patterning process

Resist composition and patterning process using the same

Positive resist compositions and patterning process

Positive resist compositions and patterning process

Method for preparing partially tert-butoxylated poly(p-hydroxystyrene)

Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component

Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

YASUDA HIROYUKI

Chemically amplified positive resist composition and patterning process

Chemically amplified positive resist composition and patterning process

KINSHO TAKESHI

Naphthalene derivative, resist bottom layer material, and patterning process

Naphthalene derivative, resist bottom layer material, resist bottom layer forming method, and patterning process

KORI DAISUKE

Biphenyl derivative, resist bottom layer material, bottom layer forming method, and patterning process

TAKEMURA KATSUYA

Double patterning process

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Pattern formation method

SHIN ESTU CHEMICAL CO LTD

Silicon-containing resist composition and patterning process

IBM

Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

WATANABE TAKERU

Resist underlayer film composition, process for forming resist underlayer film, patterning process and fullerene derivative