Inventor

AHMAD SYED SAJID

US33 patents

Patents

33 patents

US6329705B1Dec 11, 2001

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes

MICRON TECHNOLOGY INC112 citations99

US5994784ANov 30, 1999

Die positioning in integrated circuit packaging

MICRON TECHNOLOGY INC135 citations99

US6331448B1Dec 18, 2001

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

MICRON TECHNOLOGY INC90 citations98

US6569753B1May 27, 2003

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

MICRON TECHNOLOGY INC74 citations96

US6525408B2Feb 25, 2003

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

MICRON TECHNOLOGY INC53 citations96

US6483044B1Nov 19, 2002

Interconnecting substrates for electrical coupling of microelectronic components

MICRON TECHNOLOGY INC74 citations96

US7041533B1May 9, 2006

Stereolithographic method for fabricating stabilizers for semiconductor devices

MICRON TECHNOLOGY INC19 citations93

US6998334B2Feb 14, 2006

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

MICRON TECHNOLOGY INC19 citations93

US6946732B2Sep 20, 2005

Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same

MICRON TECHNOLOGY INC22 citations93

US6353326B2Mar 5, 2002

Test carrier with molded interconnect for testing semiconductor components

MICRON TECHNOLOGY INC15 citations93

US6500697B2Dec 31, 2002

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

MICRON TECHNOLOGY INC20 citations92

US6436732B2Aug 20, 2002

Apparatus for applying viscous materials to a lead frame

MICRON TECHNOLOGY INC23 citations92

US6204093B1Mar 20, 2001

Method and apparatus for applying viscous materials to a lead frame

MICRON TECHNOLOGY INC14 citations82

US7169693B2Jan 30, 2007

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

MICRON TECHNOLOGY INC9 citations74

US6911735B2Jun 28, 2005

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

MICRON TECHNOLOGY INC7 citations74

US6796028B2Sep 28, 2004

Method of Interconnecting substrates for electrical coupling of microelectronic components

MICRON TECHNOLOGY INC10 citations74

US6544461B1Apr 8, 2003

Test carrier with molded interconnect for testing semiconductor components

MICRON TECHNOLOGY INC7 citations74

US6528867B1Mar 4, 2003

Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice

MICRON TECHNOLOGY INC12 citations74

US6336974B1Jan 8, 2002

Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

MICRON TECHNOLOGY INC5 citations74

US6316952B1Nov 13, 2001

Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements

MICRON TECHNOLOGY INC13 citations74

US6040205AMar 21, 2000

Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

MICRON TECHNOLOGY INC8 citations74

US5960712AOct 5, 1999

Screens for use in a screen printing system

MICRON TECHNOLOGY INC9 citations74

US5759875AJun 2, 1998

Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use

MICRON TECHNOLOGY INC7 citations74

US6983551B2Jan 10, 2006

Interconnecting substrates for electrical coupling of microelectronic components

MICRON TECHNOLOGY INC3 citations63

US6982386B2Jan 3, 2006

Interconnecting substrates for electrical coupling of microelectronic components

MICRON TECHNOLOGY INC3 citations63

US6919229B2Jul 19, 2005

Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

MICRON TECHNOLOGY INC1 citations63

US6703260B2Mar 9, 2004

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

MICRON TECHNOLOGY INC2 citations63

US6642730B1Nov 4, 2003

Test carrier with molded interconnect for testing semiconductor components

MICRON TECHNOLOGY INC4 citations63

US7589010B2Sep 15, 2009

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

MICRON TECHNOLOGY INC0 citations52

US7095106B2Aug 22, 2006

Collars, support structures, and forms for protruding conductive structures

MICRON TECHNOLOGY INC0 citations52

AHMAD SYED SAJID

Patents

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes

Die positioning in integrated circuit packaging

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

Interconnecting substrates for electrical coupling of microelectronic components

Stereolithographic method for fabricating stabilizers for semiconductor devices

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same

Test carrier with molded interconnect for testing semiconductor components

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

Apparatus for applying viscous materials to a lead frame

Method and apparatus for applying viscous materials to a lead frame

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

Method of Interconnecting substrates for electrical coupling of microelectronic components

Test carrier with molded interconnect for testing semiconductor components

Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice

Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

Flexible conductive structures and method

Apparatus for applying viscous materials to a lead frame

Die positioning in integrated circuit packaging

Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements

Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

Screens for use in a screen printing system

Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use

Interconnecting substrates for electrical coupling of microelectronic components

Interconnecting substrates for electrical coupling of microelectronic components

Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

Test carrier with molded interconnect for testing semiconductor components

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Collars, support structures, and forms for protruding conductive structures