Inventor

KLEIN RITA J

US76 patents

⚠️ This page may combine multiple inventors who share the name “KLEIN RITA J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KLEIN RITA J

MICRON TECHNOLOGY INC

Electroless plating of metal caps for chalcogenide-based memory devices

Electroless deposition of doped noble metals and noble metal alloys

System for planarizing microelectronic substrates having apertures

Method for planarizing microelectronic substrates having apertures

Electro- and electroless plating of metal in the manufacture of PCRAM devices

Electro-and electroless plating of metal in the manufacture of PCRAM devices

Methods of forming capacitor constructions

Method of selectively removing conductive material

Methods for planarization of group VIII metal-containing surfaces using complexing agents

Electroless plating of metal caps for chalcogenide-based memory devices

Electro- and electroless plating of metal in the manufacture of PCRAM devices

Methods for planarization of Group VIII metal-containing surfaces using complexing agents

Method of forming a mass over a semiconductor substrate

Method for filling electrically different features

Electroless deposition of doped noble metals and noble metal alloys

Nitride layer forming methods

Nitride layer forming method

Assemblies having conductive structures with three or more different materials

Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

Integrated assemblies having conductive posts extending through stacks of alternating materials

Assemblies having conductive structures with three or more different materials

Memory arrays and methods of fabricating integrated structure

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

Tungsten structures and methods of forming the structures

Tungsten structures and methods of forming the structures

Three-dimensional memory with conductive rails in conductive tiers, and related apparatus, systems, and methods

Integrated assemblies having conductive posts extending through stacks of alternating materials

Methods of fabricating integrated structures

Memory arrays

Electro- and electroless plating of metal in the manufacture of PCRAM devices

Electro-and electroless plating of metal in the manufacture of PCRAM devices

Electroless deposition of doped noble metals and noble metal alloys

Electroless deposition of doped noble metals and noble metal alloys

Memory device including control gates having tungsten structure

Memory device including control gates having tungsten structure

Microelectronic devices, memory devices, and electronic systems

Microelectronic devices and memory devices including conductive levels having varying compositions

Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material

Microelectronic devices including staircase structures, and related memory devices and electronic systems

Microelectronic devices including conductive levels having varying compositions, and related memory devices, electronic systems, and methods

Memory arrays and methods used in forming a memory array comprising strings of memory cells

Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material

Memory arrays and methods used in forming a memory array

LODESTAR LICENSING GROUP LLC

Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material

Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devices

Memory arrays and methods used in forming a memory array comprising strings of memory cells

Assemblies having conductive structures with three or more different materials

UNIV TOLEDO

Electroless plating of a metal layer on an activated substrate

WELLS DAVID H

Methods of forming metal silicide-comprising material and methods of forming metal silicide-comprising contacts