Inventor
LEI LAWRENCE CHUNG-LAI
US46 patents
⚠️ This page may combine multiple inventors who share the name “LEI LAWRENCE CHUNG-LAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
37 patentsUS6551929B1Apr 22, 2003
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
APPLIED MATERIALS INC396 citations99
US6302965B1Oct 16, 2001
Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces
APPLIED MATERIALS INC209 citations99
US5856240AJan 5, 1999
Chemical vapor deposition of a thin film onto a substrate
APPLIED MATERIALS INC275 citations99
US5800686ASep 1, 1998
Chemical vapor deposition chamber with substrate edge protection
APPLIED MATERIALS INC266 citations99
US5766365AJun 16, 1998
Removable ring for controlling edge deposition in substrate processing apparatus
APPLIED MATERIALS INC435 citations99
US6777352B2Aug 17, 2004
Variable flow deposition apparatus and method in semiconductor substrate processing
APPLIED MATERIALS INC119 citations98
US5888304AMar 30, 1999
Heater with shadow ring and purge above wafer surface
APPLIED MATERIALS INC374 citations98
US6603269B1Aug 5, 2003
Resonant chamber applicator for remote plasma source
APPLIED MATERIALS INC252 citations97
US6364954B2Apr 2, 2002
High temperature chemical vapor deposition chamber
APPLIED MATERIALS INC342 citations97
US6159299ADec 12, 2000
Wafer pedestal with a purge ring
APPLIED MATERIALS INC134 citations97
US5695568ADec 9, 1997
Chemical vapor deposition chamber
APPLIED MATERIALS INC95 citations97
US7674715B2Mar 9, 2010
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC35 citations96
US7465666B2Dec 16, 2008
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC47 citations96
US7235486B2Jun 26, 2007
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC43 citations96
US7115494B2Oct 3, 2006
Method and system for controlling the presence of fluorine in refractory metal layers
APPLIED MATERIALS INC30 citations96
US7085616B2Aug 1, 2006
Atomic layer deposition apparatus
APPLIED MATERIALS INC42 citations96
US7033922B2Apr 25, 2006
Method and system for controlling the presence of fluorine in refractory metal layers
APPLIED MATERIALS INC30 citations96
US6855368B1Feb 15, 2005
Method and system for controlling the presence of fluorine in refractory metal layers
APPLIED MATERIALS INC58 citations96
US6494955B1Dec 17, 2002
Ceramic substrate support
APPLIED MATERIALS INC82 citations96
US6206971B1Mar 27, 2001
Integrated temperature controlled exhaust and cold trap assembly
APPLIED MATERIALS INC90 citations96
US5882419AMar 16, 1999
Chemical vapor deposition chamber
APPLIED MATERIALS INC46 citations96
US6827815B2Dec 7, 2004
Showerhead assembly for a processing chamber
APPLIED MATERIALS INC133 citations95
US6277199B1Aug 21, 2001
Chamber design for modular manufacturing and flexible onsite servicing
APPLIED MATERIALS INC61 citations95
US6103014AAug 15, 2000
Chemical vapor deposition chamber
APPLIED MATERIALS INC62 citations95
US5935338AAug 10, 1999
Chemical vapor deposition chamber
APPLIED MATERIALS INC63 citations95
US7846840B2Dec 7, 2010
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC19 citations93
US6430468B1Aug 6, 2002
Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber
APPLIED MATERIALS INC45 citations93
US6063441AMay 16, 2000
Processing chamber and method for confining plasma
APPLIED MATERIALS INC42 citations92
US6517592B2Feb 11, 2003
Cold trap assembly
APPLIED MATERIALS INC21 citations91
US5810936ASep 22, 1998
Plasma-inert cover and plasma cleaning process and apparatus employing same
APPLIED MATERIALS INC28 citations91
US5705080AJan 6, 1998
Plasma-inert cover and plasma cleaning process
APPLIED MATERIALS INC41 citations91
US7722719B2May 25, 2010
Gas baffle and distributor for semiconductor processing chamber
APPLIED MATERIALS INC22 citations90
US7705275B2Apr 27, 2010
Substrate support having brazed plates and resistance heater
APPLIED MATERIALS INC25 citations86
US8027746B2Sep 27, 2011
Atomic layer deposition apparatus
APPLIED MATERIALS INC4 citations74
US7860597B2Dec 28, 2010
Atomic layer deposition apparatus
APPLIED MATERIALS INC5 citations74
US7660644B2Feb 9, 2010
Atomic layer deposition apparatus
APPLIED MATERIALS INC4 citations74
US6793766B2Sep 21, 2004
Apparatus having platforms positioned for precise centering of semiconductor wafers during processing
APPLIED MATERIALS INC9 citations74
ARCHERS INC
2 patentsLEI LAWRENCE CHUNG-LAI
2 patentsLEI LAWRENCE CHUNG LAI
2 patentsUS11024762B2Jun 1, 2021
Substrate processing system, substrate conveying device and conveying method
LEI LAWRENCE CHUNG LAI0 citations62
US10854497B2Dec 1, 2020
Apparatus and method of selective turning over a row of substrates in an array of substrates in a processing system
LEI LAWRENCE CHUNG LAI0 citations51