Inventor
HEPPLER STEVEN W
US10 patents
⚠️ This page may combine multiple inventors who share the name “HEPPLER STEVEN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
8 patentsUS6746894B2Jun 8, 2004
Ball grid array interposer, packages and methods
MICRON TECHNOLOGY INC249 citations97
US6399464B1Jun 4, 2002
Packaging die preparation
MICRON TECHNOLOGY INC48 citations95
US7026548B2Apr 11, 2006
Moisture-resistant electronic device package and methods of assembly
MICRON TECHNOLOGY INC22 citations92
US6953891B2Oct 11, 2005
Moisture-resistant electronic device package and methods of assembly
MICRON TECHNOLOGY INC31 citations92
US6162703ADec 19, 2000
Packaging die preparation
MICRON TECHNOLOGY INC29 citations92
US5248075ASep 28, 1993
IC pin forming machine with integrated IC testing capability
MICRON TECHNOLOGY INC98 citations92
US7274095B2Sep 25, 2007
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers
MICRON TECHNOLOGY INC12 citations82
US7528007B2May 5, 2009
Methods for assembling semiconductor devices and interposers
MICRON TECHNOLOGY INC5 citations71