Inventor
YIN LENG NAM
SG5 patents
Patents
5 patentsUS6746894B2Jun 8, 2004
Ball grid array interposer, packages and methods
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US6650013B2Nov 18, 2003
Method of manufacturing wire bonded microelectronic device assemblies
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US6864166B1Mar 8, 2005
Method of manufacturing wire bonded microelectronic device assemblies
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US7274095B2Sep 25, 2007
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers
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US7528007B2May 5, 2009
Methods for assembling semiconductor devices and interposers
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