Inventor
TIAN EDMUND LUA KOON
SG6 patents
Patents
6 patentsUS6746894B2Jun 8, 2004
Ball grid array interposer, packages and methods
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US6825572B2Nov 30, 2004
Die package
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US7274095B2Sep 25, 2007
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers
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US7528007B2May 5, 2009
Methods for assembling semiconductor devices and interposers
MICRON TECHNOLOGY INC5 citations71
US6919645B2Jul 19, 2005
Die package
MICRON TECHNOLOGY INC4 citations67
US7489028B2Feb 10, 2009
Die package
MICRON TECHNOLOGY INC1 citations56