Inventor
ENG YAP KAH
SG3 patents
Patents
3 patentsUS6746894B2Jun 8, 2004
Ball grid array interposer, packages and methods
MICRON TECHNOLOGY INC249 citations97
US7274095B2Sep 25, 2007
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers
MICRON TECHNOLOGY INC12 citations82
US7528007B2May 5, 2009
Methods for assembling semiconductor devices and interposers
MICRON TECHNOLOGY INC5 citations71