Inventor
WILSON WILLIAM E
US29 patents
⚠️ This page may combine multiple inventors who share the name “WILSON WILLIAM E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS6204453B1Mar 20, 2001
Two signal one power plane circuit board
IBM173 citations98
US6175087B1Jan 16, 2001
Composite laminate circuit structure and method of forming the same
IBM170 citations98
US6451509B2Sep 17, 2002
Composite laminate circuit structure and method of forming the same
IBM117 citations97
US6664485B2Dec 16, 2003
Full additive process with filled plated through holes
IBM66 citations96
US6479093B2Nov 12, 2002
Composite laminate circuit structure and methods of interconnecting the same
IBM50 citations96
US6388204B1May 14, 2002
Composite laminate circuit structure and methods of interconnecting the same
IBM75 citations96
US6781064B1Aug 24, 2004
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
IBM16 citations92
US6750405B1Jun 15, 2004
Two signal one power plane circuit board
IBM19 citations92
US6521844B1Feb 18, 2003
Through hole in a photoimageable dielectric structure with wired and uncured dielectric
IBM33 citations92
US6418616B2Jul 16, 2002
Full additive process with filled plated through holes
IBM24 citations92
US6264851B1Jul 24, 2001
Selective seed and plate using permanent resist
IBM20 citations92
US6195883B1Mar 6, 2001
Full additive process with filled plated through holes
IBM37 citations92
US6204456B1Mar 20, 2001
Filling open through holes in a multilayer board
IBM48 citations91
US5427895AJun 27, 1995
Semi-subtractive circuitization
IBM27 citations91
US6852152B2Feb 8, 2005
Colloidal seed formulation for printed circuit board metallization
IBM12 citations84
US7353590B2Apr 8, 2008
Method of forming printed circuit card
IBM10 citations83
US6986198B2Jan 17, 2006
Method of forming printed circuit card
IBM6 citations73
US6830875B2Dec 14, 2004
Forming a through hole in a photoimageable dielectric structure
IBM3 citations62
ENDICOTT INTERCONNECT TECH INC
3 patentsUS7293355B2Nov 13, 2007
Apparatus and method for making circuitized substrates in a continuous manner
ENDICOTT INTERCONNECT TECH INC18 citations91
US7328502B2Feb 12, 2008
Apparatus for making circuitized substrates in a continuous manner
ENDICOTT INTERCONNECT TECH INC6 citations72
US7381587B2Jun 3, 2008
Method of making circuitized substrate
ENDICOTT INTERCONNECT TECH INC2 citations63