Inventor

TODA JUNKO

JP10 patents

⚠️ This page may combine multiple inventors who share the name “TODA JUNKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MANIWA SUSUMU

3 patents

US8535987B2Sep 17, 2013

Method of manufacturing substrate for semiconductor element, and semiconductor device

MANIWA SUSUMU2 citations58

US8546940B2Oct 1, 2013

Manufacturing method of lead frame substrate and semiconductor apparatus

MANIWA SUSUMU0 citations47

US8466547B2Jun 18, 2013

Method for manufacturing substrate for semiconductor element, and semiconductor device

MANIWA SUSUMU0 citations37

TODA JUNKO

2 patents

US8319322B2Nov 27, 2012

Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device

TODA JUNKO2 citations56

US8390105B2Mar 5, 2013

Lead frame substrate, manufacturing method thereof, and semiconductor apparatus

TODA JUNKO0 citations36

TOPPAN PRINTING CO LTD

2 patents

US8703598B2Apr 22, 2014

Manufacturing method of lead frame substrate

TOPPAN PRINTING CO LTD1 citations50

US8535979B2Sep 17, 2013

Method for manufacturing substrate for semiconductor element

TOPPAN PRINTING CO LTD0 citations50

TSUKAMOTO TAKEHITO

2 patents

US8558363B2Oct 15, 2013

Lead frame substrate and method of manufacturing the same, and semiconductor device

TSUKAMOTO TAKEHITO0 citations45

US8304294B2Nov 6, 2012

Lead frame substrate and method of manufacturing the same

TSUKAMOTO TAKEHITO0 citations33

SAITO MASAKO

1 patent

US8809478B2Aug 19, 2014

Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition

SAITO MASAKO4 citations69