Inventor

TAKANO TADASHI

US47 patents

⚠️ This page may combine multiple inventors who share the name “TAKANO TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKANO TADASHI

MORIC KK

Rotating electrical apparatus

Stator coil structure for revolving-field electrical machine and method of manufacturing same

Coil winding for DC machine

Method of manufacturing stator coil structure for revolving-field electrical machine

Permanent magnet type rotor and permanent magnet type rotary electrical machine

Permanent magnet 2-phase DC brushless motor

Permanent magnet type three-phase AC rotary electric machine

Method and device for detecting rotational drive force

Construction of power assisting synchronous motor

Method of winding skewed armature and device therefor

Method of winding armature of revolving-field electric machine and armature

Stator coil structure for revolving-field electrical machine and method of manufacturing same

Laminated iron core for rotary electric machine

Method and manufacturing stator coil structure for revolving field electrical machine

Method of winding armature of revolving field electric machine and armature

Armature, method and apparatus thereof

FUJI SEAL INT INC

Pouch container

Pouch container

Pouch container

Method for manufacturing intermediate material for soft packaging container, method for manufacturing soft packaging container, and method for manufacturing soft packaging container packaging body

Pouch

Manufacturing method and manufacturing apparatus for pouch container

Pouch-container packaging material, and pouch-container packaging body

CANON KK

Driving system for stepping motor

Image reading device

Image forming apparatus

Image forming apparatus constructed to have a high heat radiating efficiency

Henkel IP & Holding GmbH

Methods to control wafer warpage upon compression molding thereof and articles useful therefor

Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages

Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages

HENKEL AG & CO KGAA

Sinterable bonding material and semiconductor device using the same

Sinterable bonding material and semiconductor device using the same

Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same

NIPPON TELEGRAPH & TELEPHONE

Aperture antenna having the improved cross-polarization performance

Offset dual-reflector aerial having tapered reflector segments in main reflector

NAT STARCH CHEM INVEST

Method to improve high temperature cohesive strength with adhesive having multi-phase system

Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates

NIPRO CORP

Infusion bag

MORIYAMA IND

DC brushless machine

HENKEL CORP

Adhesive compositions for use in die attach applications

KAIJO KK

Bonder

MITSUBISHI ELECTRIC CORP

Antenna mirror-surface measuring system

NAGASE & CO LTD

Methods for manufacturing semiconductor device and wiring structure

NGUYEN MY

Adhesive compositions for use in die attach applications

FUJIWARA HIROSHI

Pressing mold and method for producing the same

TAKANO TADASHI

Document processing apparatus, document processing system and data structure of document file

ELECS IND CO LTD

Method for calibrating microwave radiometer