Inventor
HSU YU-MEI
TW10 patents
⚠️ This page may combine multiple inventors who share the name “HSU YU-MEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
6 patentsUS7619307B1Nov 17, 2009
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
POWERTECH TECHNOLOGY INC7 citations70
US8049339B2Nov 1, 2011
Semiconductor package having isolated inner lead
POWERTECH TECHNOLOGY INC2 citations61
US7821112B2Oct 26, 2010
Semiconductor device with wire-bonding on multi-zigzag fingers
POWERTECH TECHNOLOGY INC0 citations51
US7750444B2Jul 6, 2010
Lead-on-chip semiconductor package and leadframe for the package
POWERTECH TECHNOLOGY INC1 citations51
US7723828B2May 25, 2010
Semiconductor package with leads on a chip having multi-row of bonding pads
POWERTECH TECHNOLOGY INC1 citations51
US7812430B2Oct 12, 2010
Leadframe and semiconductor package having downset baffle paddles
POWERTECH TECHNOLOGY INC0 citations48