Inventor
NAKAZAWA MOTOKI
JP7 patents
Patents
7 patentsUS9793236B2Oct 17, 2017
Wire-bonding apparatus and method of manufacturing semiconductor device
SHINKAWA KK7 citations82
US9457421B2Oct 4, 2016
Wire-bonding apparatus and method of wire bonding
SHINKAWA KK7 citations82
US9337166B2May 10, 2016
Wire bonding apparatus and bonding method
SHINKAWA KK9 citations82
US9368471B2Jun 14, 2016
Wire-bonding apparatus and method of manufacturing semiconductor device
SHINKAWA KK3 citations71
US9379086B2Jun 28, 2016
Method of manufacturing semiconductor device
SHINKAWA KK4 citations67
US9028649B2May 12, 2015
Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same
SHINKAWA KK2 citations60
US9978713B2May 22, 2018
Method of manufacturing semiconductor device and wire bonding apparatus
SHINKAWA KK0 citations50