Inventor
LIAO GUO-CHENG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “LIAO GUO-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
17 patentsUS10971798B2Apr 6, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations72
US10847470B2Nov 24, 2020
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US9978705B2May 22, 2018
Semiconductor substrate and semiconductor package structure having the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US9117697B2Aug 25, 2015
Semiconductor substrate and method for making the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US12261350B2Mar 25, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11721884B2Aug 8, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11362049B2Jun 14, 2022
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US11296001B2Apr 5, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11107777B2Aug 31, 2021
Substrate structure and semiconductor package structure including the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US9437565B2Sep 6, 2016
Semiconductor substrate and semiconductor package structure having the same
ADVANCED SEMICONDUCTOR ENG2 citations62
US7763982B2Jul 27, 2010
Package substrate strip, metal surface treatment method thereof and chip package structure
ADVANCED SEMICONDUCTOR ENG4 citations61
US11670836B2Jun 6, 2023
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations56
US11217509B2Jan 4, 2022
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG0 citations52
US7999389B2Aug 16, 2011
Via hole structure with a conductive layer formed therein
ADVANCED SEMICONDUCTOR ENG0 citations51
US7994429B2Aug 9, 2011
Manufacturing method and structure for a substrate with vertically embedded capacitor
ADVANCED SEMICONDUCTOR ENG0 citations51
US7816608B2Oct 19, 2010
CTS and inspecting method thereof
ADVANCED SEMICONDUCTOR ENG0 citations51
US11404799B2Aug 2, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations43