Inventor

DING YI-CHUAN

TW36 patents

⚠️ This page may combine multiple inventors who share the name “DING YI-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DING YI-CHUAN

ADVANCED SEMICONDUCTOR ENG

Semiconductor build-up package

Thermal enhanced ball grid array package

Method for making a build-up package of a semiconductor

Chip scale package and manufacturing method

Multi-chip package substrate for flip-chip and wire bonding

Process for manufacturing a substrate with embedded capacitor

Thermally enhanced semiconductor build-up package

Semiconductor device having conductive via and manufacturing process

Stackable semiconductor package and manufacturing method thereof

Staggered wirebonding configuration

Cavity down ball grid array package structure and carrier thereof

Semiconductor device package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor substrate and semiconductor package structure having the same

Semiconductor substrate and method for making the same

Chip scale package

Method and structure for prevention leakage of substrate strip

Solder mask and structure of a substrate

Substrate strip and manufacturing method thereof

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Substrate structure and semiconductor package structure including the same

Semiconductor substrate and semiconductor package structure having the same

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package device

Semiconductor device having conductive via and manufacturing process for same

Chip package and producing method thereof

Semiconductor package device and method of manufacturing the same

Substrate having pillar group and semiconductor package having pillar group

Circuit substrate

DING YI-CHUAN

Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof

Semiconductor device packages including connecting elements

CHEN CHIA-CHING

Semiconductor package including a stacking element