Inventor

YAZAKI MASAKI

JP11 patents

⚠️ This page may combine multiple inventors who share the name “YAZAKI MASAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAINIPPON PRINTING CO LTD

10 patents

US9773960B2Sep 26, 2017

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD5 citations83

US9159655B2Oct 13, 2015

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD3 citations72

US9214414B2Dec 15, 2015

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD1 citations61

US9899583B2Feb 20, 2018

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD0 citations51

US9553247B2Jan 24, 2017

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD0 citations51

US9412923B2Aug 9, 2016

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD0 citations51

US9362473B2Jun 7, 2016

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

DAINIPPON PRINTING CO LTD0 citations51

US9870983B2Jan 16, 2018

Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

DAINIPPON PRINTING CO LTD0 citations48

US9543169B2Jan 10, 2017

Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

DAINIPPON PRINTING CO LTD0 citations48

US9257306B2Feb 9, 2016

Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

DAINIPPON PRINTING CO LTD0 citations48

ODA KAZUNORI

1 patent

US8933548B2Jan 13, 2015

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

ODA KAZUNORI14 citations90