Inventor

SHIMADA TOMOKAZU

JP6 patents

⚠️ This page may combine multiple inventors who share the name “SHIMADA TOMOKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

2 patents

US9318346B2Apr 19, 2016

CMP polishing liquid and polishing method

HITACHI CHEMICAL CO LTD1 citations47

US10876000B2Dec 29, 2020

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

HITACHI CHEMICAL CO LTD0 citations45

TESSERA INTERCONNECT MATERIALS INC

1 patent

US7923828B2Apr 12, 2011

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

TESSERA INTERCONNECT MATERIALS INC16 citations78

MISHIMA KOUJI

1 patent

US9944827B2Apr 17, 2018

CMP polishing solution and polishing method

MISHIMA KOUJI3 citations64

ENDO KIMITAKA

1 patent

US8859420B2Oct 14, 2014

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

ENDO KIMITAKA2 citations60

KANAMARU MAMIKO

1 patent

US8883031B2Nov 11, 2014

CMP polishing liquid and polishing method

KANAMARU MAMIKO1 citations40