Inventor
CHANG KA FAI
TW14 patents
⚠️ This page may combine multiple inventors who share the name “CHANG KA FAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11222884B2Jan 11, 2022
Layout design methodology for stacked devices
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11756951B2Sep 12, 2023
Layout design methodology for stacked devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11088084B2Aug 10, 2021
Electromagnetic shielding metal-insulator-metal capacitor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10665550B2May 26, 2020
Electromagnetic shielding metal-insulator-metal capacitor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10971485B2Apr 6, 2021
Solenoid inductors within a multi-chip package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12027513B2Jul 2, 2024
Layout design methodology for stacked devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12009260B2Jun 11, 2024
Method and system of forming integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11694973B2Jul 4, 2023
Electromagnetic shielding metal-insulator-metal capacitor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11545298B2Jan 3, 2023
Method of forming entangled inductor structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10943729B2Mar 9, 2021
Entangled inductor structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10811316B2Oct 20, 2020
Method and system of forming integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
AGENCY SCIENCE TECH & RES
3 patentsUS11018080B2May 25, 2021
Semiconductor package and method of forming the same
AGENCY SCIENCE TECH & RES11 citations77
US11569146B2Jan 31, 2023
Semiconductor package and method of forming the same
AGENCY SCIENCE TECH & RES0 citations41
US10720339B2Jul 21, 2020
Fan-out wafer-level packaging method and the package produced thereof
AGENCY SCIENCE TECH & RES0 citations41