Inventor
LEE KI JU
KR27 patents
⚠️ This page may combine multiple inventors who share the name “LEE KI JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS7953986B2May 31, 2011
Method of protecting data saved to recording medium and data storage apparatus adopting method
SAMSUNG ELECTRONICS CO LTD15 citations92
US7814261B2Oct 12, 2010
Flash memory and method of dynamically loading firmware operation module in optical drive
SAMSUNG ELECTRONICS CO LTD21 citations92
US7334121B2Feb 19, 2008
Flash memory system including a duplicate booting program and apparatus and method for protecting the same flash memory
SAMSUNG ELECTRONICS CO LTD13 citations83
US6154428ANov 28, 2000
Technique for setting speed of optical disk player according to condition of optical disk
SAMSUNG ELECTRONICS CO LTD17 citations83
US6098026AAug 1, 2000
Method of testing performance of spindle motor in CD-ROM drive
SAMSUNG ELECTRONICS CO LTD8 citations73
US7921332B2Apr 5, 2011
Disc drive failure diagnostic system and method
SAMSUNG ELECTRONICS CO LTD3 citations62
US7472287B2Dec 30, 2008
Method of protecting data saved to recording medium and disk drive adopting the method
SAMSUNG ELECTRONICS CO LTD3 citations62
US11201108B2Dec 14, 2021
Semiconductor package mounted substrate
SAMSUNG ELECTRONICS CO LTD1 citations54
US11894310B2Feb 6, 2024
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US7536685B2May 19, 2009
Method of updating firmware
SAMSUNG ELECTRONICS CO LTD1 citations51
US11209445B2Dec 28, 2021
Blood testing apparatus and control method thereof
SAMSUNG ELECTRONICS CO LTD0 citations49
US9964553B2May 8, 2018
Blood testing apparatus and blood testing method thereof
SAMSUNG ELECTRONICS CO LTD1 citations49
US9753819B2Sep 5, 2017
Test device and method for controlling the same
SAMSUNG ELECTRONICS CO LTD1 citations48
US9482680B2Nov 1, 2016
Test platform, test apparatus and control method thereof
SAMSUNG ELECTRONICS CO LTD0 citations46
US11923314B2Mar 5, 2024
Semiconductor package including a trench in a passivation layer
SAMSUNG ELECTRONICS CO LTD0 citations45
US10756021B2Aug 25, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations42
SAMSUNG ELECTRO MECH
3 patentsUS8740040B2Jun 3, 2014
Solder injection head
SAMSUNG ELECTRO MECH22 citations90
US10163746B2Dec 25, 2018
Semiconductor package with improved signal stability and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations71
US10356911B2Jul 16, 2019
Electronic device module and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations41
KIM JONG-CHEOL
3 patentsUS8605937B2Dec 10, 2013
Method of adjusting brightness of illumination device and bio disk drive using the method
KIM JONG-CHEOL0 citations50
US8490122B2Jul 16, 2013
Disc chucking method and disc driving apparatus
KIM JONG-CHEOL0 citations50
US8456127B2Jun 4, 2013
Method of obtaining image of disc and apparatus for driving disc
KIM JONG-CHEOL1 citations50