Inventor

LIN LIANG-CHEN

TW23 patents

⚠️ This page may combine multiple inventors who share the name “LIN LIANG-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN LIANG-CHEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and manufacturing process thereof

CoWos interposer with selectable/programmable capacitance arrays

Reliability testing method

Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors

Semiconductor device including cumulative sealing structures

Semiconductor device including cumulative sealing structures and method and system for making of same

Semiconductor package and manufacturing process thereof

Reliability testing method and apparatus

Semiconductor structure and manufacturing method for the same

Semiconductor package structure with polymeric layer and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

System-in-package packaging for minimizing bond wire contamination and yield loss

Bonding and probing pad structures

Methods for forming stacked capacitors with fuse protection

Flip chip packages with spacers separating heat sinks and substrates

Bond pad design to minimize dielectric cracking

Test structure

Test structure

TAIWAN SEMINCONDUCTOR MFG CO L

Solder bump structure and method of manufacturing same

MOSEL VITELIC INC

Flash memory process using polysilicon spacers

AU OPTRONICS CORP

Display and gate driver thereof

TSAO PEI-HAW

System-in-package packaging for minimizing bond wire contamination and yield loss

SU SHIANG-RUEI

Test chip, test board and reliability testing method

HOU FU-TSAI

Bump-on-trace structures with wide and narrow portions