Inventor

YU JENGYI

US37 patents

⚠️ This page may combine multiple inventors who share the name “YU JENGYI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU JENGYI

LAM RES CORP

Photoresist development with halide chemistries

Tin oxide films in semiconductor device manufacturing

Eliminating yield impact of stochastics in lithography

Eliminating yield impact of stochastics in lithography

Tin oxide films in semiconductor device manufacturing

Etching substrates using ale and selective deposition

Underlayer for photoresist adhesion and dose reduction

Alternating etch and passivation process

Underlayer for photoresist adhesion and dose reduction

Atomic layer etching for enhanced bottom-up feature fill

Tin oxide films in semiconductor device manufacturing

Integrated dry processes for patterning radiation photoresist patterning

Tin oxide mandrels in patterning

Integrated dry processes for patterning radiation photoresist patterning

Alternating etch and passivation process

Etching substrates using ALE and selective deposition

Tin oxide films in semiconductor device manufacturing

Tin oxide films in semiconductor device manufacturing

Photoresist development with halide chemistries

Photoresist development with halide chemistries

Underlayer for photoresist adhesion and dose reduction

Tin oxide mandrels in patterning

Alternating etch and passivation process

Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement

Eliminating yield impact of stochastics in lithography

Method for cleaning a chamber

Selective etch using a sacrificial mask

Removing metal contamination from surfaces of a processing chamber

Removing metal contamination from surfaces of a processing chamber

Surface modification for metal-containing photoresist deposition

NOVELLUS SYSTEMS INC

Stress profile modulation in STI gap fill

Biased H2 etch process in deposition-etch-deposition gap fill

Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper

YU JENGYI

Interfacial capping layers for interconnects

Metal and silicon containing capping layers for interconnects

CYPRESS SEMICONDUCTOR CORP

Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit

Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit