Inventor
TAN SAMANTHA SIAMHWA
US27 patents
Patents
27 patentsUS12105422B2Oct 1, 2024
Photoresist development with halide chemistries
LAM RES CORP13 citations94
US11355353B2Jun 7, 2022
Tin oxide mandrels in patterning
LAM RES CORP15 citations85
US12211691B2Jan 28, 2025
Dry development of resists
LAM RES CORP8 citations84
US10515816B2Dec 24, 2019
Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)
LAM RES CORP6 citations84
US12510825B2Dec 30, 2025
Photoresist development with halide chemistries
LAM RES CORP2 citations74
US12510826B2Dec 30, 2025
Photoresist development with halide chemistries
LAM RES CORP2 citations74
US11670516B2Jun 6, 2023
Metal-containing passivation for high aspect ratio etch
LAM RES CORP3 citations72
US12119243B2Oct 15, 2024
Plasma etching chemistries of high aspect ratio features in dielectrics
LAM RES CORP1 citations71
US11935758B2Mar 19, 2024
Atomic layer etching for subtractive metal etch
LAM RES CORP2 citations71
US11594429B2Feb 28, 2023
Plasma etching chemistries of high aspect ratio features in dielectrics
LAM RES CORP1 citations71
US12080562B2Sep 3, 2024
Atomic layer etch and ion beam etch patterning
LAM RES CORP1 citations62
US11450532B2Sep 20, 2022
Deposition of self assembled monolayer for enabling selective deposition and etch
LAM RES CORP0 citations62
US12550660B2Feb 10, 2026
Plasma etching chemistries of high aspect ratio features in dielectrics
LAM RES CORP0 citations61
US12417902B2Sep 16, 2025
Method for cleaning a chamber
LAM RES CORP0 citations61
US12266542B2Apr 1, 2025
Atomic layer etching for subtractive metal etch
LAM RES CORP0 citations61
US12062537B2Aug 13, 2024
High etch selectivity, low stress ashable carbon hard mask
LAM RES CORP0 citations61
US12037686B2Jul 16, 2024
Selective carbon deposition
LAM RES CORP0 citations61
US12027375B2Jul 2, 2024
Selective etch using a sacrificial mask
LAM RES CORP1 citations60
US12400842B2Aug 26, 2025
Method of cleaning chamber components with metal etch residues
LAM RES CORP0 citations59
US12191125B2Jan 7, 2025
Removing metal contamination from surfaces of a processing chamber
LAM RES CORP0 citations59
US11842888B2Dec 12, 2023
Removing metal contamination from surfaces of a processing chamber
LAM RES CORP1 citations59
US12249514B2Mar 11, 2025
Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layers
LAM RES CORP0 citations57
US12586765B2Mar 24, 2026
Surface modification for metal-containing photoresist deposition
LAM RES CORP0 citations51
US12550646B2Feb 10, 2026
Selectively etching for nanowires
LAM RES CORP0 citations51
US11521860B2Dec 6, 2022
Selectively etching for nanowires
LAM RES CORP0 citations48
US12341021B2Jun 24, 2025
Selective etch using deposition of a metalloid or metal containing hardmask
LAM RES CORP0 citations47
US12256645B2Mar 18, 2025
Chemical etch nonvolatile materials for MRAM patterning
LAM RES CORP0 citations47